| ISBN： | 9789811999161 |
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| ISBN： | 9811999163 |
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| 编目源： | N$T N$T N$T GW5XE YDX EBLCP UKAHL BNG OCLCF OCLCQ OCLCO |
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| 个人名称： | Lau, John H., |
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| 题名： | Chiplet design and heterogeneous integration packaging / Edited by John H. Lau. |
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| 出版发行项： | Singapore : Springer, [2023] |
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| 载体形态： | xxii, 525 pages : illustrations ; 24 cm |
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| 书目附注： | Includes bibliographical references (pages 509-517) and index. |
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| 格式化内容附注： | State-of-the-Art of Advanced Packaging -- Chip Partition and Chip Split -- Multiple System and Heterogeneous Integration with TSV Interposers -- Multiple System and Heterogeneous Integration with TSV-Less Interposers -- Chiplets Lateral (Horizontal) Communications -- Cu-Cu Hybrid Bonding. |
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